Molded pocket in transaction card construction

ABSTRACT

Methods and apparatuses are provided for manufacturing a transaction card. The disclosed methods and apparatuses may be used to form a transaction card frame within a mold. The transaction card frame may include one or more recessed portions formed within a first surface of the transaction card frame. The one or more recessed portions may be configured for affixing one or more electronic components.

PRIORITY CLAIM

This application claims priority under 35 U.S.C. § 119 to U.S.Provisional Application No. 62/241,636, filed on Oct. 14, 2015, andentitled “Molded Pocket in Transaction Card Construction,” which isexpressly incorporated herein by reference in its entirety.

TECHNICAL FIELD

The disclosed embodiments generally relate to transaction cardconstruction, and particularly, to molding a pocket into a transactioncard.

BACKGROUND

Transaction cards, such as credit and debit cards, have increasinglybecome a primary means for customers to complete financial transactions.Typically, transaction cards are cut from laminated sheets of polyvinylchloride (PVC) or polycarbonate (PC), or other similar materials. Afterthe overall shape of the card is formed, the card may be modified to addfunctional and/or visual features. For example, a magnetic strip may beaffixed to one side, the card may be stamped with the card number andcustomer name, and color or a design may be added for appearance.

Many transaction card providers are moving away from using magneticstrip technology and now additionally or alternatively include moreadvanced electronic components attached to or embedded within atransaction card. For example, some transaction cards include microchips(e.g., Europay, Mastercard, and Visa (EMV) chips) that more securely andefficiently manage card and customer information. While the chipsprovide several advantages to customers, they can increase thecomplexity and cost of transaction card manufacturing.

For example, manufacturing a transaction card that includes anelectronic component (such as an EMV chip) may include additional stepsto create space(s) for the component and steps to secure the componentwithin the space(s). Often, a process known as milling and embedding isused. In this process, a computer numerical control (CNC) machine isused to mill away a space, called a pocket, of a desired size foraccommodating or receiving an electronic component (e.g., an EMV chip).The term “pocket” refers to a recessed portion of a structure and mayinclude a base portion, one or more walls projecting from the baseportion, and an opening formed by the one or more walls. The term“pocket” may also refer to a cavity, a hole, or a container. Thecomponent is then embedded or secured into the space (i.e., pocket)using a hot press adhesive. The milling and embedding processes aretypically performed together in an in-line machine.

In addition, as transaction cards increase in prevalence, expectationsfor transaction card quality have increased. Transaction cards haveincreasingly been made to meet higher standards regarding materials,manufacturing tolerances, and overall “fit and finish.” Accordingly,tolerance of defects in transaction cards related to manufacturingprocesses has decreased over time.

The present disclosure is directed to overcoming one or more of theproblems set forth above and/or other problems associated withconventional transaction card construction.

SUMMARY

The disclosed embodiments relate to a process for constructing atransaction card that includes a molded pocket.

Consistent with a disclosed embodiment, a method of manufacturing atransaction card is provided. The method may include forming atransaction card frame within a mold, the transaction card frameincluding at least one recessed portion within a first surface; andaffixing at least one electronic component to an interior of the atleast one recessed portion.

Consistent with another disclosed embodiment, a mold for molding atransaction card is provided. The mold may include a first plate and asecond plate. The first plate and second plate may be joined together,forming a cavity for receiving a material for forming a transaction cardframe. The first plate and the second plate of the mold may includestructures that define a shape and dimension of at least one recessedportion to be formed within a first surface of the transaction cardframe, the at least one recessed portion configured for affixing atleast one electronic component.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory onlyand are not restrictive of the disclosed embodiments, as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of this specification, illustrate disclosed embodiments and,together with the description, serve to explain the disclosedembodiments. In the drawings:

FIG. 1 is a block diagram of an exemplary transaction system, consistentwith disclosed embodiments;

FIG. 2A is a front view of an exemplary transaction card frame,consistent with disclosed embodiments;

FIG. 2B is a back view of an exemplary transaction card frame,consistent with disclosed embodiments;

FIG. 3 is a cross-sectional view of the exemplary transaction card frameFIG. 2A taken along line 3-3, consistent with disclosed embodiments;

FIG. 4A is a schematic perspective view of a first plate of an exemplarymold for producing transaction card frames, consistent with disclosedembodiments;

FIG. 4B is a schematic perspective view of a second plate of anexemplary mold for producing transaction card frames, consistent withdisclosed embodiments;

FIG. 5A is a perspective view of the first plate and the second plate ofthe exemplary mold shown in FIGS. 4A and 4B stacked together, consistentwith disclosed embodiments;

FIG. 5B is a cross-sectional view of the exemplary mold of FIG. 5A takenalong line 5-5, consistent with disclosed embodiments;

FIG. 6A is a perspective view of a first plate of an exemplary mold forproducing transaction card frames, consistent with disclosedembodiments;

FIG. 6B is perspective view of a second plate of an exemplary mold forproducing transaction card frames, consistent with disclosedembodiments;

FIG. 7A is a perspective view of the first plate and the second plate ofthe exemplary mold shown in FIGS. 6A and 6B stacked together, consistentwith disclosed embodiments;

FIG. 7B is a cross-sectional view of the exemplary mold of FIG. 7A takenalong line 6-6, consistent with disclosed embodiments;

FIG. 8A is a perspective view of a first plate of an exemplary mold forproducing transaction card frames, consistent with disclosedembodiments;

FIG. 8B is a perspective view of a second plate of an exemplary mold forproducing transaction card frames, consistent with disclosedembodiments;

FIG. 9A is a perspective view of the first plate and the second plate ofthe exemplary mold shown in FIGS. 8A and 8B stacked together, consistentwith disclosed embodiments;

FIG. 9B is a cross-sectional view of the exemplary mold of FIG. 9A takenalong line 8-8, consistent with disclosed embodiments; and

FIG. 10 is a flowchart showing an exemplary method for forming atransaction card, consistent with the disclosed embodiments.

DETAILED DESCRIPTION

Reference will now be made in detail to the disclosed embodiments,examples of which are illustrated in the accompanying drawings. Whereverconvenient, the same reference numbers will be used throughout thedrawings to refer to the same or like parts.

Disclosed embodiments include apparatuses and methods for manufacturinga transaction card. For example, disclosed embodiments include a moldfor injection molding or compression molding of a transaction card frameincluding a pocket (or a recessed portion) to accommodate (or receive,affix) an electronic component. Various methods may be used tomanufacture the transaction card frame out of different types ofmaterials that are suitable for satisfying certain criteria orpreferences. In addition, the disclosed embodiments may reduce costs orcomplexity of card manufacturing when compared to traditional processes.

The term “transaction card,” as used herein, may refer to any physicalcard product that is configured to provide information, such asfinancial information (e.g., card numbers, account numbers, etc.),quasi-financial information (e.g., rewards balance, discountinformation, etc.) and/or individual-identifying information (e.g.,name, address, etc.), when the card is read by a card reader. Examplesof transaction cards include credit cards, debit cards, gift cards,rewards cards, frequent flyer cards, merchant-specific cards, discountcards, identification cards, and driver's licenses, but are not limitedthereto.

Transaction cards may be flat objects configured to slide through a cardreader, inserted into a card reading slot, or otherwise physicallyinteract with a card reading device. Cards may be manufactured to sizetolerances intended to allow the cards to slide through, fit inside, orotherwise physically interact with such a device. For example, atransaction card may be manufactured to conform to the ISO/IEC 7810 ID-1standard, and have dimensions of 85.60 mm×53.98 mm×0.76 mm. Thisstandard is merely exemplary, as other standards may be used, and somecards may deviate from a standard in such a way that they may stillproperly interact with certain card reading devices.

FIG. 1 illustrates an exemplary transaction system 10. Transactionsystem 10 may include a computing system configured to receive and sendinformation between the components of transaction system 10 and withcomponents outside of transaction system 10. Transaction system 10 mayinclude a financial service provider system 12 and a merchant system 14communicating with each other through a network 16. Transaction system10 may include additional and/or alternative components.

Financial service provider system 12 may include one or more computersystems associated with an entity that provides financial services. Forexample, the entity may be a bank, credit union, credit card issuer, orother type of financial service entity that generates, provides,manages, and/or maintains financial service accounts for one or morecustomers. Financial service accounts may include, for example, creditcard accounts, checking accounts, savings accounts, loan accounts,reward accounts, and any other types of financial service accounts.Financial service accounts may be associated with physical financialservice transaction cards, such as credit or debit cards that customersuse to perform financial service transactions, such as purchasing goodsand/or services online or at a point of sale (POS) terminal. Financialservice accounts may also be associated with electronic financialproducts and services, such as a digital wallet or similar account thatmay be used to perform electronic transactions, such as purchasing goodsand/or services online.

Merchant system 14 may include one or more computer systems associatedwith a merchant. For example, merchant system 14 may be associated withan entity that provides goods and/or services (e.g., a retail store).The merchant may include brick-and-mortar location(s) that a customermay physically visit and purchase goods and services using thetransaction cards. Such physical locations may include computing devices(e.g., merchant system 14) that perform financial service transactionswith customers (e.g., POS terminal(s), kiosks, etc.). Additionally oralternatively, merchant system 14 may be associated with a merchant whoprovides an electronic shopping environment, such as a website or otheronline platforms that consumers may access using a computer throughbrowser software, a mobile application, or similar software. Merchantsystem 14 may include a client device, such as a laptop computer,desktop computer, smart phone, or tablet, which a customer may operateto access the electronic shopping mechanism.

Network 16 may include any type of network configured to facilitatecommunications and data exchange between components of transactionsystem 10, such as, for example, financial service provider system 12and merchant system 14. Network 16 may include a Local Area Network(LAN) or a Wide Area Network (WAN), such as the Internet. Network 16 maybe a single network or a combination of networks. Network 16 is notlimited to the above examples and transaction system 10 may implementany type of network that allows entities (shown and not shown) oftransaction system 10 to exchange data and information.

Transaction system 10 may be configured to conduct a transaction using atransaction card 20. In some embodiments, financial service providersystem 12 may provide transaction card 20 to a customer for use inconducting transactions associated with a financial service account heldby the customer. For example, the customer may use transaction card 20at a merchant location to make a purchase. During the course of thepurchase, information may be transferred from transaction card 20 tomerchant system 14 (e.g., a point of sale device). Merchant system 14may communicate with financial service provider system 12 via network 16to verify the information and to complete or deny the transaction. Forexample, merchant system 14 may receive account information fromtransaction card 20. Merchant system 14 may transmit the accountinformation and a purchase amount, among other transaction information,to financial service provider system 12. Financial service providersystem 12 may settle the transaction by transferring funds from thecustomer's financial service account to a financial service accountassociated with the merchant.

While transaction system 10 and transaction card 20 are depicted anddescribed in relation to transactions that involve customers, merchants,and financial service providers, it should be understood that the theseentities are used only as an example to illustrate one environment inwhich transaction card 20 may be used. Transaction card 20 is notlimited to financial products and may be any physical card product thatis configured to provide information to another device when read by acard reader. For example, transaction card 20 may be an identificationcard configured to provide information to a device in order to identifythe holder of the card (e.g., driver's license).

In some embodiments, transaction card 20 may further include anelectronic component 22. As used herein, an “electronic component” maybe one or more devices and/or elements configured to receive, store,process, provide, transfer, send, delete, and/or generate information.For example, electronic component 22 may be a microchip (e.g., EMVchip), a communication device (e.g., Near Field Communication (NFC)antenna, Bluetooth® device, WiFi device), a magnetic strip, a barcode,Quick Response (QR) code, etc. Electronic component 22 may be secured(or affixed, attached) to a transaction card frame 24 (or card frame 24)in such a way that allows card frame 24 to carry electronic component 22while maintaining a utility of electronic component 22 (i.e., allowingelectronic component 22 to interact with merchant system 14).

FIG. 2A is a front view of an exemplary transaction card frame 24. FIG.2B is a rear view of the card frame 24. FIG. 2A shows a front side 202of card frame 24 and FIG. 2B shows a rear side 204 of card frame 24. Asshown in FIG. 2A, card frame 24 includes a pocket 206 configured toaccommodate (or receive, affix, or secure) electronic component 22.Pocket 206 may include features that accommodate a particular geometryof electronic component 22 or enable electronic component 22 to be fixed(or secured, affixed, attached, or embedded) to card frame 24.

Card frame 24 may include an upper surface 208 (or first surface 208).Pocket 206 may include a second surface 210 recessed a first depth fromfirst surface 208 of card frame 24. Pocket 206 may also include a thirdsurface 212. Third surface 212 may be recessed a second depth from firstsurface 208. The second depth may be greater than the first depth. Thatis, third surface 212 may form a base portion of pocket 206, and secondsurface 210 may form an elevated surface at a certain height above thirdsurface 212. The dimensions and depths of second surface 210 and thirdsurface 212 may be set based on a plurality of criteria such as the sizeof a particular electronic component, industry standards, manufacturingtolerances, or other considerations. Based on the geometry of theelectronic component to be embedded in pocket 206, pocket 206 mayinclude fewer (e.g., one) or more (e.g., three, four, etc.) surfacesrecessed from first surface 208.

For example, in some embodiments, pocket 206 may be configured toaccommodate a microchip, such as an EMV chip. In these embodiments,first surface 208 may be referred to as P0. Second surface 210 may bereferred to as P1 and used as a glue layer for a contact plate of theEMV chip. Third surface 212 may be referred to as P2 and used as adeeper pocket to accommodate the depth of the EMV chip itself.

FIG. 3 illustrates a cross-sectional view of an exemplary embodiment ofcard frame 24 shown in FIG. 2 taken along line 3-3. FIG. 3 includes amagnified view of pocket 206 which illustrates surfaces 208, 210, and212. As shown in the magnified view of pocket 206, second surface 210 isrecessed a first depth H1 from first surface 208, and third surface 212is recessed a second depth H2 from first surface 208. The dimensions(e.g., widths and heights or depths) of surfaces 208, 210, and 212 mayvary based on the dimensions of the electronic component. For example,in some embodiments, first depth H1 may be 0.21 mm (with an errortolerance of +/−0.02 mm), and second depth H2 may be 0.62 mm (with anerror tolerance of +/−0.02 mm).

Card frame 24 may be manufactured using a molding process, such as aninjection molding process or a compression molding process. Althoughinjection molding is discussed in detail as an example of the moldingprocess, some features discussed below may also be applied to thecompression molding process.

During an injection molding process, any material suitable for injectionmolding, such as thermoplastic and thermosetting polymers, may be usedfor forming card frame 24. Injection and/or ejection molds used to formcard frame 24 may include structures for forming pocket 206 within cardframe 24 either without additional milling, or with reduced millingsteps than required by conventional transaction card manufacturingprocesses.

FIG. 4A is a schematic perspective view of a first plate 402 (or firstcomponent) of an exemplary mold 400 for manufacturing card frame 24, andFIG. 4B is a schematic perspective view of a second plate 404 (or secondcomponent) of mold 400. Mold 400 may be constructed of any material ormaterials suitable for use as an injection or compression mold, such asvarious grades of steel or aluminum. First plate 402 includes a surface406 that defines surface 208 of card frame 24. In some embodiments,surface 406 is substantially flat. Surface 406 may include a protrusionstructure 408 protruding from the rest of surface 406. Protrusionstructure 408 defines the shape and dimension of pocket 206. Forexample, protrusion structure 408 may include a first protrusion portion410 (also shown in FIG. 5B) protruding a first distance from surface406. The first distance may be substantially the same as the first depthH1 shown in FIG. 3. The first protrusion portion 410 defines secondsurface 210 of pocket 206. Protrusion structure 408 may include a secondprotrusion portion 412 (also shown in FIG. 5B) protruding a seconddistance from surface 406. The second distance may be greater than thefirst distance. The second distance may be substantially the same as thesecond depth H2 shown in FIG. 3. The second protrusion portion 412defines third surface 212 of pocket 206.

First plate 402 may include a gate 414 formed on surface 406. Gate 414is an opening on surface 406, and is configured to receive a materialfor forming card frame 24 during the injection molding process. Gate 414may be connected with a channel 504 (shown in FIG. 5B) extendingthroughout the thickness of first plate 402. Second plate 404 mayinclude a through hole for receiving a pin 416. Second plate 402 mayinclude a surface 418. Surface 418 may include a shape corresponding torear side 204 of card frame 24 and may define rear side 204.

FIG. 5A is a perspective view of first plate 402 and second plate 404 ofmold 400 shown in FIGS. 4A and 4B stacked or joined together. FIG. 5B isa cross-sectional view of mold 400 of FIG. 5A taken along line 5-5. Asshown in FIG. 5B, when the first plate 402 and second plate 404 arejoined together, surface 406 and surface 418 define a space or cavity502 for receiving a material for forming card frame 24 during aninjection molding process. Cavity 502 has substantially the samethree-dimensional shape and dimensions as card frame 24. As shown inFIG. 5B, protrusion structure 408 and surface 418 defines the shape anddimension of pocket 206.

As shown in FIG. 5B, gate 414 may be connected with channel 504 forreceiving a material for constructing or forming card frame 24 during amolding process. Pin 416 is accommodated within a through hole formedwithin second plate 404. Pin 416 may be configured for releasing moldedcard frame 24 from mold 400. During manufacturing, a material forconstructing card frame 24 may be heated and injected through channel504 and gate 414 such that the material fills cavity 502, therebyforming card frame 24 including pocket 206 that includes one or moresurfaces recessed from first surface 208. In some embodiments, thesurfaces included in pocket 206 recessed from first surface 208 may beformed during the same molding process using the same mold. Mold 400 maythen be cooled to harden the material. First plate 402 and second plate404 may be separated and pin 416 may be extended into the through holeformed in second plate 404 to separate the hardened material of cardframe 24 from second plate 404.

In some embodiments, one or more surfaces of pocket 206 may be formed bya molding process, and one or more surfaces of pocket 206 may be formedby a milling process. For example, surface 210 may be formed by molding,whereas surface 212 may be formed by milling. Alternatively, surface 210may be formed by milling, whereas surface 212 may be formed by molding.

In some embodiments an electronic component may be added to pocket 206without additional milling. As an example, mold 400 may produce cardframe 24 of appropriate dimensions such that an EMV chip may be affixedwithin pocket 206 as a next step in a transaction card manufacturingprocess after removing card frame 24 from mold 400.

In other embodiments, after separating card frame 24 from mold 400,further steps may be performed on card frame 24. For example, undesiredor excessive materials may be milled away from the interior of therecessed portion. In some embodiments, gate 414 may leave marks on cardframe 24 as a result of separating hardened material left in channel 504from card frame 24. Further, material may seep into margins between anejection pin and one or more of the surfaces of mold 400, resulting inmarks on a surface of card frame 24. Marks such as those left by a gateor ejection pin are often viewed as undesirable defects. Such defectsmay be minor such that they are considered acceptable or imperceptibleor alternatively may be removed by corrective steps such as sanding,buffing, grinding, or milling.

In some embodiments, components of mold 400 may be arranged to allowsteps for removing defects to be combined with other steps involved inmanufacturing transaction card 20. For example gates and/or ejectionpins may be located strategically such that any marks that may be lefton card frame 24 may be covered by a component later affixed to cardframe 24, painted or printed over, or removed in a subsequent millingstep. This principle is illustrated in further detail in FIGS. 6-9.

FIG. 6A is a perspective view of a first plate 602 of an exemplary mold600 for producing transaction card frames. FIG. 6B is a perspective viewof a second plate 604 of mold 600. Mold 600 may include structures andfunctions similar to mold 400, and may be used in the same or similarprocess for forming card frame 24 as discussed above in connection withmold 400. First plate 602 and second plate 604 may include structuressimilar to those of mold 400, except for the location of the gate andpins. Similar to mold 400, mold 600 may include first surface 606configured to define first surface 208 of card frame 24. First surface606 may include a protrusion structure 608, which may be similar toprotrusion structure 408, configured for defining the shape anddimension of pocket 206. For example, protrusion structure 608 mayinclude a protrusion portion 610 for defining a recessed surface (e.g.,surface 212) in pocket 206. Additional protrusion portions, such as onesimilar to protrusion portion 412, may also be included in protrusionstructure 608. Second plate 604 may include a surface 618, which may besimilar to surface 418 of second plate 404.

As shown in FIG. 6A, first plate may include a gate 614 disposed at asuitable portion of protrusion structure 608, which defines pocket 206.For example, gate 614 may be disposed at a surface of protrusion portion610 of protrusion structure 608, which may define a base portion orsurface (e.g., surface 212) of pocket 206. Gate 614 may be disposed suchthat an undesired mark left by gate 614 during manufacturing may beremoved or hidden by the installation of electronic component 22. Thus,any location on protrusion structure 608 that corresponds to a locationwithin an interior of pocket 206 may be suitable for gate 614, if a markleft at the gate 614 will be hidden by the electronic component 22 afterthe electronic component 22 is installed or embedded within pocket 206.

As shown in FIG. 6B, second plate 604 may include a surface 618, whichmay be similar to surface 418 of mold 400. Second plate 604 may includetwo through holes for receiving two pins 616. The pins may be used forejecting card frame 24 after the material for forming card frame 24 hasbeen hardened. Fewer or additional through holes may be included insecond plate 604. The locations of the through holes may be differentfrom the location of the through hole included in second plate 404.

FIG. 7A is a perspective view of first plate 602 and second plate 604shown in FIGS. 6A and 6B joined together to form mold 600. FIG. 7B is across-sectional view of mold 600 shown in FIG. 7A taken along line 6-6.As shown in FIG. 7B, when joined together, surface 606 and surface 618may form a space or cavity 702 for receiving a material for forming cardframe 24 during an injection molding process. Cavity 702 may havesubstantially the same three-dimensional shape and dimensions as cardframe 24. Protrusion structure 608 and surface 618 define the shape anddimension of pocket 206. During manufacturing, a material forconstructing card frame 24 may be heated and injected through channel704 and gate 614, similar to the process described above in relation toFIGS. 4A-5B.

Upon separation of plates 602 and 604, gate 614 may leave a mark on asurface (e.g., surface 212) of card frame 24. However, the gate mark maybe covered by the installation of an electronic component into pocket206. Alternatively, the gate mark and an area surrounding the gate markmay be removed by, for example, milling or cutting. This may beachieved, for example, during a process for creating a surface (e.g.,surface 210 or 212) on the resulting card frame 24. Thus, the steps ofremoving the gate mark and forming a specified surface to accommodate anelectronic component may be combined.

Referring back to FIG. 6B, pins 616 may leave marks on card frame 24.However, in some embodiments, pins 616 may be disposed such that theresulting marks may be eliminated by the application of a component, totransaction card 20. For example, a magnetic strip may be applied ontocard frame 24 at a location that covers the marks. Alternatively, arecessed surface may be, for example, cut or milled into the surface ofcard frame 24 prior to application of a magnetic strip. The step ofadding the recessed surface may also remove the marks left by pins 616.

FIG. 8A is a perspective view of a first plate 804 of an exemplary mold800 for producing transaction card frames. FIG. 8B is a perspective viewof a second plate 802 of mold 800. Mold 800 may include structures andfunctions similar to mold 400 or mold 600, and may be used in the sameor similar process for forming card frame 24 as discussed above inconnection with mold 400 or 600. Different features included in molds400, 600, and 800 may be combined.

First plate 804 may include a surface 806 that defines a shape of firstsurface 208 of card frame 24. Similar to surfaces 406 and 606 shown inFIGS. 4A and 6A, surface 806 may include a protrusion structure 808protruding from the rest of surface 806. Protrusion structure 808 mayinclude one or more protrusion portions that define the shape anddimension of pocket 206. For example, protrusion structure 808 mayinclude a protrusion portion 810 that defines a surface (e.g., surface212) of pocket 206. First plate 804 may include a through hole forreceiving a pin 816 for ejecting finished card frame 24. The throughhole may be disposed at any suitable location on a surface of protrusionstructure 808, such as on a surface of protrusion portion 810, whichcorresponds to an interior of pocket 206 to be formed. In this way, anymark left by pin 816 may be hidden when an electronic component isinstalled or embedded within pocket 206. After card frame 24 is formedin an injection molding process, pin 816 may be extended into thethrough hole located at a location corresponding to the interior of therecessed portion to release the card frame from the mold.

As shown in FIG. 8B, second plate 802 may include a surface 818, whichmay be similar to surface 418 and 618. Surface 818 may be configured fordefining rear side 204 of card frame 24. Surface 818 may include one ormore gates 814. Similar to gates 414 and 614, gates 814 may be connectedwith one or more channels (not shown in FIG. 8B) for receiving amaterial for forming card frame 24. Gates 814 may be disposed in linewith pin 816, or may be disposed at locations that are not in line withpin 816.

FIG. 9A is a perspective view of the first plate 804 and the secondplate 802 of mold 800 shown in FIGS. 8A and 8B stacked or joinedtogether. FIG. 9B is a cross-sectional view of mold 800 of FIG. 9A takenalong line 8-8. As shown in FIG. 9B, when joined together, surfaces 806and 818 define a space or cavity 902 configured to receive a materialfor forming card frame 24 during an injection molding process. Thecavity 902 has substantially the same shape and dimensions as card frame24. Protrusion structure 808 and surface 818 define the shape anddimension of pocket 206. Pin 816 is disposed within a through hole thatincludes an opening on a surface of protrusion portion 810 at a locationcorresponding to pocket 206. Any mark left by pin 816 may be covered byelectronic component 22 when electronic component 22 is installed orembedded within pocket 206. Gates 814 and channels are not shown in thecross-sectional view in FIG. 9B, because they are not located in linewith pin 816 (or the through hole for receiving the pin).

Referring back to FIG. 8B, a material for constructing card frame 24 maybe heated and injected through gates 814, similar to the processdescribed above. Upon separation of plates 802 and 804, pin 816 mayleave a mark on a surface (e.g., surface 212) of card frame 24. The markmay be removed using the steps described above, or the mark may behidden by the installation of an electronic component into pocket 206.In addition, gates 814 may leave marks on a surface (e.g. surface 208)of card frame 24. An area surrounding these marks may be removed tocreate an additional surface on the resulting card frame 24, forexample, for installing a magnetic strip, thereby removing the marks.

While illustrative embodiments have been described herein, the scopeincludes any and all embodiments having equivalent elements,modifications, omissions, combinations (e.g., of aspects across variousembodiments), adaptations or alterations based on the presentdisclosure. For example, in some embodiments, a compression moldingprocess may be used to form card frame 24 instead of an injectionmolding process. In such embodiments, injection gates, such as gates414, 614, and 814, may not be included in mold 400. Instead, materialfor forming card frame 24 may be placed in mold 400 and compressed toconform to the shape of a cavity of the mold (e.g., cavity 502, 702,902, etc.). In the compression molding process, pocket 206 may be formedby corresponding structures on the mold, and may not require millingduring the formation of pocket 206.

FIG. 10 is a flowchart showing an exemplary method 1000 for forming atransaction card. Method 1000 may include forming a transaction cardframe within a mold, the transaction card frame including at least onerecessed portion within a first surface (step 1010). The mold may be anyof mold 400, 600, and 800 disclosed above. In some embodiments, formingthe transaction card frame within the mold may include injection moldingthe transaction card frame using any of mold 400, 600, or 800. Injectionmolding the transaction card frame using the mold may include injectinga material for forming the transaction card frame through a gatedisposed in the mold at a location corresponding to the at least onerecessed portion. In some embodiments, forming the transaction cardframe within the mold may include compression molding the transactioncard frame within the mold. The mold may include a structure for moldingthe at least one recessed portion within the first surface of thetransaction card frame, and forming the transaction card frame withinthe mold may include forming the at least one recessed portion withinthe mold for affixing the at least one electronic component.

In some embodiments, forming the at least one recessed portion withinthe mold for affixing the at least one electronic component does notinvolve milling to form the at least one recessed portion.

Method 1000 may also include affixing at least one electronic componentto an interior of the at least one recessed portion (step 1020). Theelectronic component may be affixed to the interior of the recessedportion using any suitable methods, such as adhering using an adhesive,press fitting, screwing, clamping, etc.

The elements in the claims are to be interpreted broadly based on thelanguage employed in the claims and not limited to examples described inthe present specification or during the prosecution of the application,which examples are to be construed as non-exclusive. It is intended,therefore, that the specification and examples be considered as exampleonly, with a true scope and spirit being indicated by the followingclaims and their full scope of equivalents.

1-20. (canceled)
 21. Apparatus for manufacturing a transaction card, theapparatus comprising: a mold, including: a cavity in the mold forreceiving a material to be molded into a transaction card frame, thetransaction card frame including a first surface, a recessed portionwithin the first surface having a second surface, the second surfacerecessed a depth from the first surface, the recessed portion configuredto receive an electrical component; a through hole disposed in the moldfor receiving a pin to be driven through the through hole to release amolded transaction card frame from the mold; and a protrusion structureconfigured to form the recessed portion, the through hole being disposedto pass through the protrusion structure, wherein the pin driven throughthe through hole leaves a mark in the recessed portion of the moldedtransaction card frame.
 22. The apparatus of claim 21, wherein theprotrusion structure includes a first protrusion portion protruding afirst distance and a second protrusion portion protruding a seconddistance.
 23. The apparatus of claim 22, wherein the first protrusionportion defines the second surface in the recessed portion.
 24. Theapparatus of claim 23, wherein the second protrusion portion defines athird surface in the recessed portion.
 25. The apparatus of claim 22,wherein the protrusion structure includes a third protrusion portionprotruding a third distance.
 26. The apparatus of claim 25, wherein athird protrusion portion defines a fourth surface in the recessedportion.
 27. The apparatus of claim 22, wherein the first distance is0.19-0.23 mm, and the second distance is 0.60-0.64 mm.
 28. The apparatusof claim 21, wherein the material is a thermoplastic or a thermosettingpolymer.
 29. The apparatus of claim 21, wherein the mold is constructedusing steel or aluminum.
 30. The apparatus of claim 21, wherein the moldis arranged to allow steps for removing defects in a subsequentmanufacturing step through the through hole.
 31. The apparatus of claim21, wherein the cavity is formed by first and second interior surfacesof the mold, the mold further including a gate formed in the first orsecond interior surfaces configured to receive the material to bemolded.
 32. The apparatus of claim 31, wherein the mold comprises afirst plate joinable to a second plate to form the cavity therebetween.33. The apparatus of claim 32, wherein the first plate or the secondplate includes the through hole to receive the pin.
 34. The apparatus ofclaim 33, wherein the gate is included in the first plate and thethrough hole to receive the pin is in the second plate.
 35. Theapparatus of claim 32, wherein the gate is included in the first plate,the first plate including two of the through holes for receiving two ofthe pins.
 36. The apparatus of claim 32, wherein the gate is included inthe first plate, the second plate including two of the through holes forreceiving two of the pins.
 37. The apparatus of claim 32, wherein thegate is disposed within the first plate or the second plate.
 38. Theapparatus of claim 32, wherein the protrusion structure includes thegate, wherein a mark left by the gate during manufacturing is located inthe recessed portion.
 39. The apparatus of claim 32, further including achannel passing through a portion of the mold from an exterior surfaceto the gate, the channel for receiving the heated material to be molded.40. The apparatus of claim 32, wherein the first plate and the secondplate are arranged to allow steps for removing defects in a subsequentmanufacturing step through the gate.